• DocumentCode
    2727437
  • Title

    An effective matrix compression method for GPU-accelerated thermal analysis

  • Author

    Lih-Yih Chiou ; Liang-Ying Lu ; Chieh-Yu Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2015
  • fDate
    27-29 April 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Three-dimensional integrated circuits are expected to face increasingly severe thermal challenges and cost issues as the number of stacked ICs increases. Thermal analysis for 3D ICs is urgently required to assist system designers at the early phase of design to identify hot zones. Most thermal analyses obtain detailed temperature distribution by large matrix operations, and hence reduce analysis performance. Accordingly, we propose a compressed and combined sparse row (CCSR) matrix format to be used in the proposed effective matrix compression (EMC) method for matrix multiplication on GPU. The experimental results show EMC using CCSR is on average 44.93 times faster than matrix multiplication without any special compression format and on average at least 3.09 times faster than other compression formats.
  • Keywords
    graphics processing units; integrated circuit design; matrix multiplication; temperature distribution; thermal analysis; three-dimensional integrated circuits; 3D ICs; CCSR matrix format; EMC method; GPU-accelerated thermal analysis; combined sparse row matrix format; effective matrix compression method; matrix multiplication; stacked ICs; temperature distribution; three-dimensional integrated circuits; Electromagnetic compatibility; Finite element analysis; Graphics processing units; Indexes; Integrated circuits; Sparse matrices; Thermal analysis; GPU; Three-dimensional integrated circuits; compression format; matrix multiplication; thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2015.7114505
  • Filename
    7114505