DocumentCode :
2727503
Title :
Electro-thermal modeling of a Rogowski coil sensor system
Author :
Rodriguez Estupinan, Juan Sebastian ; Vachoux, Alain ; Pascal, Joris
Author_Institution :
Microelectron. Syst. Lab. - LSM, Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
fYear :
2015
fDate :
27-29 April 2015
Firstpage :
1
Lastpage :
4
Abstract :
This paper focuses on the electro-thermal modeling of an electrical current sensor, based on the Rogowski Coil transducer. We exploit the multi-domain capabilities of VHDL-AMS together with geometrical Finite Element Analysis (FEA) to create a time-dependent parametrical model which is able to compute concurrently the thermal and electrical variables of the system. This is particularly convenient for evaluating the temperature effect in the analogue and digital signal processing of the sensor. Some key geometrical and inner material properties of the sensor and its environment, which are difficult, or even impossible to simulate dynamically in a classical lumped-element model, are taken into account in the proposed model. This modeling technique can be used to improve the accuracy in the design of the self-calibration circuit of the sensor.
Keywords :
calibration; coils; electric current measurement; electric sensing devices; finite element analysis; hardware description languages; signal processing; temperature measurement; temperature sensors; transducers; FEA; Rogowski coil sensor system; Rogowski coil transducer; VHDL-AMS; analogue signal processing; digital signal processing; electrical current sensor; electrothermal modeling; geometrical finite element analysis; geometrical material property; inner material property; lumped-element model; multidomain capability; self-calibration; temperature effect evaluation; time-dependent parametrical model; Atmospheric modeling; Geometry; Heat transfer; Mathematical model; Sensor systems; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/VLSI-DAT.2015.7114509
Filename :
7114509
Link To Document :
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