Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics

In the current research we have developed a thermally enhanced and electrically non-conductive nano-integrated adhesive for ultra-low temperature (4K) cryogenic microelectronic packaging. Ultra-low temperature niobium based (4K) superconductor microelectronics offer the unique combination of ultrafast switching speeds (up to 100GHz), high sensitivity and low power consumption. The commercialization of these cryogenic microelectronic devices in a complex multichip module architecture where the integration of heterogeneous material and increased power density is generating a need to develop new materials and techniques to enhance the thermal and electrical performance of these ultra-low temperature superconducting microelectronic packages. In the current research, authors have investigated the thermal behavior of single-walled carbon nanotube integrated adhesive for the packaging of ultra-low-temperature (4K) electronics. Test vehicles loaded with varying concentrations of purified single-walled carbon nanotube (SWNT) integrated adhesive were characterized at 4K. The nano-integrated adhesive showed increasingly higher thermal conductivity than the pure adhesive with higher loading concentration. The thermal analysis of the nano-integrated adhesive suggests that single-walled carbon nanotube filled adhesive can play a profound role as an underfill and die attach in cryo-packaging for ultra-low temperature high density multi-chip modules (MCM).