• DocumentCode
    2728359
  • Title

    Cost challenges on the way to the Internet of Things

  • Author

    Rhines, Walden C.

  • Author_Institution
    Mentor Graphics, Wilsonville, OR, USA
  • fYear
    2015
  • fDate
    27-29 April 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.
  • Keywords
    Internet of Things; intelligent actuators; intelligent sensors; low-power electronics; semiconductor device packaging; semiconductor devices; transistors; Internet of Things; IoT; big digital chips; diverse packaging; semiconductor components; semiconductor design; semiconductor production costs; smart actuators; smart sensors; transistor; ultralow power mixed signal design; Actuators; Complexity theory; Graphics; Information processing; Intelligent sensors; Internet of things; Low-power electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2015.7114553
  • Filename
    7114553