DocumentCode
2728359
Title
Cost challenges on the way to the Internet of Things
Author
Rhines, Walden C.
Author_Institution
Mentor Graphics, Wilsonville, OR, USA
fYear
2015
fDate
27-29 April 2015
Firstpage
1
Lastpage
1
Abstract
One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.
Keywords
Internet of Things; intelligent actuators; intelligent sensors; low-power electronics; semiconductor device packaging; semiconductor devices; transistors; Internet of Things; IoT; big digital chips; diverse packaging; semiconductor components; semiconductor design; semiconductor production costs; smart actuators; smart sensors; transistor; ultralow power mixed signal design; Actuators; Complexity theory; Graphics; Information processing; Intelligent sensors; Internet of things; Low-power electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-DAT.2015.7114553
Filename
7114553
Link To Document