DocumentCode
2728574
Title
An Integrated Built-In Test and Repair Approach for Memories with 2D Redundancy
Author
Öhler, Philipp ; Hellebrand, Sybille ; Wunderlich, Hans-Joachim
Author_Institution
Univ. of Paderborn, Paderborn
fYear
2007
fDate
20-24 May 2007
Firstpage
91
Lastpage
96
Abstract
An efficient on-chip infrastructure for memory test and repair is crucial to enhance yield and availability of SoCs. Therefore embedded memories are commonly equipped with spare rows and columns (2D redundancy). To avoid the storage of large failure bitmaps needed by classical algorithms for offline repair analysis, existing heuristics for built-in repair analysis (BIRA) either follow very simple search strategies or restrict the search to smaller local bitmaps. Exact BIRA algorithms work with sub analyzers for each possible repair combination. While a parallel implementation suffers from a high hardware overhead, a serial implementation leads to high test times. The integrated built-in test and repair approach proposed in this paper interleaves test and repair analysis and supports an exact solution without failure bitmap. The basic search procedure is combined with an efficient technique to continuously reduce the problem complexity and keep the test and analysis time low.
Keywords
built-in self test; logic testing; system-on-chip; 2D redundancy; SoC; built-in repair analysis; integrated built-in test; memory test; offline repair analysis; on-chip infrastructure; systems-on-a-chip; Algorithm design and analysis; Binary search trees; Built-in self-test; Costs; Data structures; Failure analysis; Hardware; Redundancy; System-on-a-chip; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 2007. ETS '07. 12th IEEE European
Conference_Location
Freiburg
Print_ISBN
0-7695-2827-9
Type
conf
DOI
10.1109/ETS.2007.10
Filename
4221579
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