DocumentCode
272878
Title
Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
Author
Falat, Tomasz ; Platek, Bartosz ; Matkowski, Przemysław ; Felba, Jan ; Zanden, Carl ; Li-lei Ye ; Liu, Jiangchuan
Author_Institution
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
fYear
2014
fDate
3-5 Dec. 2014
Firstpage
797
Lastpage
800
Abstract
Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the parabolic low, which indicates that the growth was mainly controlled by volume diffusion.
Keywords
copper alloys; diffusion; indium alloys; molecular dynamics method; solders; In-Cu; copper; indium; intermetallic compounds growth; molecular dynamics simulations; parabolic low; power LED systems; solder material; temperature 400 K; thermal interface; volume diffusion; Aging; Compounds; Copper; Indium; Intermetallic; Materials; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location
Singapore
Type
conf
DOI
10.1109/EPTC.2014.7028372
Filename
7028372
Link To Document