• DocumentCode
    2729060
  • Title

    A monolithic 3.7 W silicon power amplifier with 59% PAE at 0.9 GHz

  • Author

    Simburger, Werner ; Wohlmuth, H.-D. ; Weger, P.

  • Author_Institution
    Siemens AG, Munich, Germany
  • fYear
    1999
  • fDate
    17-17 Feb. 1999
  • Firstpage
    230
  • Lastpage
    231
  • Abstract
    Low-cost and highly-efficient RF power amplifiers with high output power are necessary for today´s mobile communications. However, monolithic integrated silicon bipolar RF power amplifiers have not yet been reported operating at high power-added efficiency (PAE) around 60%. To date, only GaAs MMICs, GaAs hybrid modules or Si power-MOS modules have been reported. The reasons for this are conduction losses, switching losses and charge-storage effects of the silicon bipolar power transistor. Further, at low supply voltages around 3 V, the on-chip interstage matching circuit is critical for high PAE and high output power. This work presents an integrated 2-stage RF power amplifier for the 0.8-1 GHz band based on spiral on-chip transformers. The application target for this power amplifier IC is a GSM mobile. The chip is fabricated in a standard 25 GHz-f/sub T/, 0.8/spl mu/m, 3-layer-interconnect silicon bipolar production technology.
  • Keywords
    UHF integrated circuits; UHF power amplifiers; bipolar analogue integrated circuits; cellular radio; elemental semiconductors; impedance matching; losses; silicon; 0.8 micron; 0.9 GHz; 25 GHz; 3.7 W; 59 percent; GSM; Si; UHF power amplifier; bipolar RF power amplifiers; charge-storage effects; conduction losses; mobile communications; on-chip interstage matching circuit; output power; power-added efficiency; spiral on-chip transformers; switching losses; Gallium arsenide; High power amplifiers; MMICs; Mobile communication; Power amplifiers; Power generation; Radio frequency; Radiofrequency amplifiers; Silicon; Switching loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1999. Digest of Technical Papers. ISSCC. 1999 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5126-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.1999.759206
  • Filename
    759206