DocumentCode
2729203
Title
Future of Nano-CMOS Technology and Its Production
Author
Iwai, Hiroshi
Author_Institution
Frontier Collaborative Res. Center, Tokyo Inst. of Technol., Yokohama
fYear
2006
fDate
3-7 July 2006
Firstpage
1
Lastpage
17
Abstract
This paper focuses on the future semiconductor manufacturing challenges. Some background information regarding the possible limits of scaling and the problems appeared in the sub-100 nm devices will be discussed, respectively, in section 2 and 3. The impacts of the future semiconductor manufacturing will be discussed in section 4. We shall also look forward to the possible geographical redistribution of the manufacturing centers and the new role playing of the present leaders in IC technology. Paradigm of post-downsizing era will be described in section 5
Keywords
nanotechnology; semiconductor device manufacture; IC technology; nano-CMOS technology; semiconductor manufacturing; Electron tubes; Electronic circuits; Intelligent robots; Intelligent sensors; Large scale integration; MOSFETs; Production; Silicon; Transistors; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location
Singapore
Print_ISBN
1-4244-0205-0
Electronic_ISBN
1-4244-0206-9
Type
conf
DOI
10.1109/IPFA.2006.250988
Filename
4017013
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