• DocumentCode
    2729419
  • Title

    Accelerated preconditioning for stack die packages

  • Author

    Hwang, Yuchul ; Jeon, Hwan-Ki ; Oh, Hye-Kyung ; Ryu, Young-Gyun ; Kang, Juseong

  • Author_Institution
    Memory Div., Samsung Electron., Co., Ltd., Hwasung, South Korea
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    1806
  • Lastpage
    1810
  • Abstract
    Accelerated moisture preconditioning condition for JEDEC/IPC level 2 has been proposed in this paper, especially focusing on stack die packages. The condition has been determined based on the equivalent moisture absorption rate, local moisture concentration at the point of interest, and following moisture induced delamination failure. Shadow moiré technique has been implemented to ensure the equivalent moisture concentration at the accelerated and normal soak conditions, and the results have been verified by physical failure analysis. The proposed accelerated preconditioning condition is to be applied to dramatically shorten the package qualification test time, finally reduce time to market of new package products.
  • Keywords
    Absorption; Acceleration; Delamination; Failure analysis; Life estimation; Moisture; Packaging; Qualifications; Testing; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490720
  • Filename
    5490720