DocumentCode :
2729419
Title :
Accelerated preconditioning for stack die packages
Author :
Hwang, Yuchul ; Jeon, Hwan-Ki ; Oh, Hye-Kyung ; Ryu, Young-Gyun ; Kang, Juseong
Author_Institution :
Memory Div., Samsung Electron., Co., Ltd., Hwasung, South Korea
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
1806
Lastpage :
1810
Abstract :
Accelerated moisture preconditioning condition for JEDEC/IPC level 2 has been proposed in this paper, especially focusing on stack die packages. The condition has been determined based on the equivalent moisture absorption rate, local moisture concentration at the point of interest, and following moisture induced delamination failure. Shadow moiré technique has been implemented to ensure the equivalent moisture concentration at the accelerated and normal soak conditions, and the results have been verified by physical failure analysis. The proposed accelerated preconditioning condition is to be applied to dramatically shorten the package qualification test time, finally reduce time to market of new package products.
Keywords :
Absorption; Acceleration; Delamination; Failure analysis; Life estimation; Moisture; Packaging; Qualifications; Testing; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490720
Filename :
5490720
Link To Document :
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