DocumentCode
2729419
Title
Accelerated preconditioning for stack die packages
Author
Hwang, Yuchul ; Jeon, Hwan-Ki ; Oh, Hye-Kyung ; Ryu, Young-Gyun ; Kang, Juseong
Author_Institution
Memory Div., Samsung Electron., Co., Ltd., Hwasung, South Korea
fYear
2010
fDate
1-4 June 2010
Firstpage
1806
Lastpage
1810
Abstract
Accelerated moisture preconditioning condition for JEDEC/IPC level 2 has been proposed in this paper, especially focusing on stack die packages. The condition has been determined based on the equivalent moisture absorption rate, local moisture concentration at the point of interest, and following moisture induced delamination failure. Shadow moiré technique has been implemented to ensure the equivalent moisture concentration at the accelerated and normal soak conditions, and the results have been verified by physical failure analysis. The proposed accelerated preconditioning condition is to be applied to dramatically shorten the package qualification test time, finally reduce time to market of new package products.
Keywords
Absorption; Acceleration; Delamination; Failure analysis; Life estimation; Moisture; Packaging; Qualifications; Testing; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV, USA
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490720
Filename
5490720
Link To Document