• DocumentCode
    2729456
  • Title

    Electroluminescence spectroscopy for reliability investigations of 1.55μm bulk semiconductor optical amplifier

  • Author

    Huyghe, S. ; Bechou, L. ; Zerounian, N. ; Deshayes, Y. ; Aniel, F. ; Denolle, A. ; Laffitte, D. ; Goudard, J.L. ; Danto, Y.

  • Author_Institution
    Lab. IXL, Bordeaux I Univ., Talence, France
  • fYear
    2006
  • fDate
    3-7 July 2006
  • Firstpage
    93
  • Lastpage
    94
  • Abstract
    Semiconductor optical amplifiers (SOAs) appear as key components for many applications for future optical networks and telecommunication systems due to various technological schemes that can be selected according to the targeted functions and performances (Eliseev, 1995). New qualification methodologies are now proposed to face the optoelectronic industry modifications and provide end-users with relevant reliability data and improve the confidence level about product quality (Goudard, 2002). Such an evolution of qualification tests requires developing experimental techniques and tools more oriented towards physical mechanisms origin but also physics of failure than usual experimental qualification tests often performed with "go-no go" status at the end of product development. In order to assess the reliability of SOAs for telecommunication applications, functional parameters monitoring is necessary, such as gain, noise figure, operating current, optical output power but also electroluminescence spectroscopy.
  • Keywords
    electroluminescent devices; semiconductor device reliability; semiconductor optical amplifiers; spectroscopy; 1.55 micron; bulk semiconductor optical amplifier; electroluminescence spectroscopy; reliability; Electroluminescence; Optical fiber networks; Performance evaluation; Physics; Qualifications; Semiconductor device reliability; Semiconductor optical amplifiers; Spectroscopy; Telecommunication network reliability; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0205-0
  • Electronic_ISBN
    1-4244-0206-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2006.251005
  • Filename
    4017030