DocumentCode :
2729647
Title :
Effects of Annealing and Temperature on SGOI Fabrication Using Ge Condensation
Author :
Balakumar, S. ; Ong, C.S. ; Tung, C.H. ; Trigg, A. ; Li, M.-F. ; Kumar, R. ; Lo, G.Q. ; Balasubramanian, N. ; Yeo, Y.C. ; Kwong, D.L.
Author_Institution :
Inst. of Microelectron., Singapore
fYear :
2006
fDate :
3-7 July 2006
Firstpage :
150
Lastpage :
153
Abstract :
In this work, we investigate the effects of oxidation temperature and annealing on Ge movement, and amorphization as an undesirable consequence of inappropriate lowering of temperature during Ge condensation. Possible mechanisms, solutions and implications are presented and it is shown that SiGe with up to 60% Ge can be obtained with oxidation and annealing at a high temperature of 1050degC
Keywords :
Ge-Si alloys; amorphisation; annealing; condensation; high-temperature electronics; oxidation; silicon-on-insulator; 1050 C; SGOI fabrication; SiGe; amorphization; annealing; condensation; oxidation; temperature effects; Amorphous materials; Annealing; Atomic force microscopy; Fabrication; Germanium silicon alloys; MOSFETs; Oxidation; Silicon germanium; Silicon on insulator technology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
1-4244-0205-0
Electronic_ISBN :
1-4244-0206-9
Type :
conf
DOI :
10.1109/IPFA.2006.251018
Filename :
4017043
Link To Document :
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