• DocumentCode
    2729743
  • Title

    Characterization of a Burn-in Failure Caused by a Defective Source Driver on TFT-LCD Panel

  • Author

    Wang, F.S.C. ; Lin, Keh-La ; Tso, Ko-Yang ; Chao, Chin-Chieh ; Wang, Wai William ; Yu, Alan ; Lee, C.Y. ; Kuo, Chien Hung ; Wang, C. W Arex ; Chiu, Yi

  • Author_Institution
    Raydium Semicond. Corp., Hsin-Chu
  • fYear
    2006
  • fDate
    3-7 July 2006
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    This paper describes a thorough investigation to identify the root cause of an LCD panel burn-in failure induced by an LCD source driver, which is observed in a large-scale LCD factory producing more than one million LCD panels per month. The investigation demonstrates the effectiveness of the circuit simulation to precisely locate the defective spot which is caused by a metal slice originated from outer rings of an LCD COG (chip-on-glass) source driver. With the aid of emission microscope (EMMI), energy dispersive analysis X-ray (EDAX), and chip probing (CP) tester, the root cause of the failure is well explained. The formation mechanism of metal slice from the outer rings is thoroughly studied. A solution to completely eliminate the source of metal slices from the outer rings during wafer processing is also proposed
  • Keywords
    driver circuits; failure analysis; liquid crystal displays; thin film transistors; LCD panel burn-in failure; LCD source driver; TFT-LCD panel; chip probing; chip-on-glass; circuit simulation; emission microscope; energy dispersive analysis X-ray; liquid crystal displays; Chaos; Circuit testing; Computer displays; Control engineering; Driver circuits; Failure analysis; Gold; Liquid crystal displays; Production facilities; Voltage; ATE; Bit-line defect; COG; CP; DVS; EDAX; EMMI; LCD driver; TFT-LCD; source driver; two-step DAC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0205-0
  • Electronic_ISBN
    1-4244-0206-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2006.251023
  • Filename
    4017048