• DocumentCode
    2729758
  • Title

    Understanding Protective Overcoat Damages: Failure Analysis to the Next Level

  • Author

    Abitan, F.V. ; Angeles, R.C. ; Fabia, M.G. ; Flores, R.C. ; Gabunas, C.B.

  • Author_Institution
    Failure Anal. Lab., Texas Instruments Philippines Inc., Baguio
  • fYear
    2006
  • fDate
    3-7 July 2006
  • Firstpage
    175
  • Lastpage
    178
  • Abstract
    Failure analysis (FA) is key in root cause identification for any problem solving journey. Diagnosis given provides insights on mechanisms by which failures occur. This helps in determining factors that lead to the failure and consequently the root cause, thus easier to provide corrective actions. In mid June 2004, a sudden increase in test fall-outs was encountered. Several devices from different product groups were affected. Fail modes reported were supply shorts and functional fails. FA on rejects showed PO damages with burnt metals as the physical defect of the rejects. PO damages are commonly induced mechanically. Burnt metals, on the other hand, are usually identified with electrical overstress (EOS) or electro-static discharge (ESD) related event. Both features were observed on inspected rejects; hence root-cause identification became a challenge. Conflicting views from counterparts added to the confusion. Experts in the US leaned on the EOS or ESD side of the case while counterparts in France maintained the mechanical angle of the issue. These conflicting inputs brought about different insights on different mechanisms leading to PO damages
  • Keywords
    electrostatic discharge; failure analysis; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; protective coatings; burnt metals; electrical overstress; electrostatic discharge; failure analysis; protective overcoat damages; root cause identification; Assembly; Earth Observing System; Electrostatic discharge; Failure analysis; Grounding; Inspection; Optical microscopy; Protection; Scanning electron microscopy; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0205-0
  • Electronic_ISBN
    1-4244-0206-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2006.251024
  • Filename
    4017049