DocumentCode :
2729822
Title :
A 1/2-inch 1.3 MPixel progressive-scan CCD image sensor employing 0.25 /spl mu/m gap single-layer poly-Si electrodes
Author :
Furumiya, M. ; Hatano, Kenji ; Nakashiba, Yasutaka ; Murakami, I. ; Yamada, Tomoaki ; Nakano, T. ; Kawakami, Y. ; Kawasaki, T. ; Hokari, Y.
Author_Institution :
ULSI Device Dev. Labs., NEC Corp., Kanagawa, Japan
fYear :
1999
fDate :
17-17 Feb. 1999
Firstpage :
300
Lastpage :
301
Abstract :
A 1/2-inch 1.3 Mpixel progressive-scan interline-transfer charge-coupled device (IT-CCD) image sensor for low-power high-sensitivity digital cameras uses 0.25 /spl mu/m-gap single-layer poly-Si for CCD electrodes to reduce drive voltage and gate overlap capacitance. The device achieved a low driving voltage (2.1 V) on a horizontal CCD at a frequency of 24.5 MHz. Pixel layout and a self-aligned photodiode structure achieve a progressive-scan pixel with controlled photodiode readout characteristics. An output 3-stage source follower amplifier with new multi-oxide transistors, whose gate insulator thickness is thinner than that of a CCD register, has 17% higher gain than that obtained using a conventional amplifier. As a result, 100 mW and -90 dB smear are obtained. The fabrication process steps are reduced to 70% of those with conventional 3-layer poly-Si electrodes.
Keywords :
CCD image sensors; cameras; capacitance; elemental semiconductors; photodiodes; silicon; CCD electrodes; digital cameras; drive voltage; driving voltage; fabrication process steps; gate insulator thickness; gate overlap capacitance; horizontal CCD; interline-transfer charge-coupled device; multi-oxide transistors; pixel layout; progressive-scan CCD image sensor; readout characteristics; self-aligned photodiode structure; single-layer polysilicon electrodes; three-stage source follower amplifier; Capacitance; Charge coupled devices; Charge-coupled image sensors; Digital cameras; Electrodes; Frequency; Image sensors; Insulation; Low voltage; Photodiodes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1999. Digest of Technical Papers. ISSCC. 1999 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
0-7803-5126-6
Type :
conf
DOI :
10.1109/ISSCC.1999.759259
Filename :
759259
Link To Document :
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