• DocumentCode
    2729822
  • Title

    A 1/2-inch 1.3 MPixel progressive-scan CCD image sensor employing 0.25 /spl mu/m gap single-layer poly-Si electrodes

  • Author

    Furumiya, M. ; Hatano, Kenji ; Nakashiba, Yasutaka ; Murakami, I. ; Yamada, Tomoaki ; Nakano, T. ; Kawakami, Y. ; Kawasaki, T. ; Hokari, Y.

  • Author_Institution
    ULSI Device Dev. Labs., NEC Corp., Kanagawa, Japan
  • fYear
    1999
  • fDate
    17-17 Feb. 1999
  • Firstpage
    300
  • Lastpage
    301
  • Abstract
    A 1/2-inch 1.3 Mpixel progressive-scan interline-transfer charge-coupled device (IT-CCD) image sensor for low-power high-sensitivity digital cameras uses 0.25 /spl mu/m-gap single-layer poly-Si for CCD electrodes to reduce drive voltage and gate overlap capacitance. The device achieved a low driving voltage (2.1 V) on a horizontal CCD at a frequency of 24.5 MHz. Pixel layout and a self-aligned photodiode structure achieve a progressive-scan pixel with controlled photodiode readout characteristics. An output 3-stage source follower amplifier with new multi-oxide transistors, whose gate insulator thickness is thinner than that of a CCD register, has 17% higher gain than that obtained using a conventional amplifier. As a result, 100 mW and -90 dB smear are obtained. The fabrication process steps are reduced to 70% of those with conventional 3-layer poly-Si electrodes.
  • Keywords
    CCD image sensors; cameras; capacitance; elemental semiconductors; photodiodes; silicon; CCD electrodes; digital cameras; drive voltage; driving voltage; fabrication process steps; gate insulator thickness; gate overlap capacitance; horizontal CCD; interline-transfer charge-coupled device; multi-oxide transistors; pixel layout; progressive-scan CCD image sensor; readout characteristics; self-aligned photodiode structure; single-layer polysilicon electrodes; three-stage source follower amplifier; Capacitance; Charge coupled devices; Charge-coupled image sensors; Digital cameras; Electrodes; Frequency; Image sensors; Insulation; Low voltage; Photodiodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1999. Digest of Technical Papers. ISSCC. 1999 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5126-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.1999.759259
  • Filename
    759259