Title :
Simulation of Cascaded H-Bridge Multilevel Inverter for liquid food sterilization with various distance of the electrodes gap
Author :
Jambari, Hanifah ; Piah, Mohamed Afendi Mohamed ; Azli, Naziha Ahmad
Abstract :
This paper presents the simulation results of the Cascaded H-Bridge Multilevel Inverter (CHMI) with various distance of the electrodes gap in liquid food sterilization using pulsed electric field (PEF). The utilization of the difference gap between the electrodes allow the system to reduce the applied voltage of the HVDC power supply, while fulfilling the requirements for effective liquid food sterilization. Thus it can reduce power consumption and will reduce cost. In this paper, the CHMI circuit has been simulated using MATLAB/Simulink and the distance of the electrodes gap has been simulated using Quickfield simulation software. Peak output voltage 1.2 kV, 2.4 kV and 6 kV with gap distance 0.1 cm, 0.2 cm and 0.5 cm respectively has been obtained in which the values can produce electric field strength of up to 12 kV/cm. All of the specifications meet the requirements for liquid food sterilization, particularly inactivate saccharomyces cerevisiae spoilage microorganisms in pineapple juice.
Keywords :
electric fields; electrochemical electrodes; food technology; invertors; microorganisms; power consumption; sterilisation (microbiological); CHMI; HVDC power supply voltage; MATLAB-Simulink simulation; PEF; cascaded H-bridge multilevel inverter; distance 0.1 cm; distance 0.2 cm; distance 0.5 cm; electric field strength; electrode gap; liquid food sterilization; pineapple juice; power consumption reduction; pulsed electric field; quickfield simulation software; saccharomyces cerevisiae spoilage microorganism; voltage 1.2 kV; voltage 2.4 kV; voltage 6 kV; Circuit simulation; Electric fields; Electrodes; Integrated circuit modeling; Microorganisms; Power demand; Power generation; electrode gap; multilevel inverter; pulsed electric field; simulation; sterilization;
Conference_Titel :
Industrial Electronics and Applications (ISIEA), 2011 IEEE Symposium on
Conference_Location :
Langkawi
Print_ISBN :
978-1-4577-1418-4
DOI :
10.1109/ISIEA.2011.6108686