• DocumentCode
    2729857
  • Title

    The Quantitative Analysis Methodology of Charged Potential by Electron Beam Bombardment for Improving the Passive Voltage Contrast on Advanced Technology

  • Author

    Chen, Y.R.

  • Author_Institution
    Dept. of Electr. Eng., National Cheng Kung Univ., Tainan
  • fYear
    2006
  • fDate
    3-7 July 2006
  • Firstpage
    192
  • Lastpage
    194
  • Abstract
    Passive voltage contrast (PVC) using electron beam (E-beam) is the popular technique of the failure analysis procedure of real integrated circuit (IC) products. When the sample is exposed on the different energy electron beam, the surface of sample is charged positively or negatively. The charging characteristic is dependent on the secondary electron yield, but that is just qualitative analysis of charging voltage using electron beam. Because of the advancement of technology, shrinking of device and lower operation voltage, the potential that the charge induced using electron beam must be considered. This methodology described in this paper is how to quantify the charging voltage when we applied the passive voltage contrast using low energy electron beam or high energy electron beam. Based on that, we can judge if the gate was turned on by this charged potential and the passive voltage contrast will be used more efficiently, especially for the soft defect on the front-end
  • Keywords
    electron beam testing; failure analysis; integrated circuit reliability; integrated circuit testing; charged potential; charging voltage; electron beam bombardment; failure analysis; integrated circuits; passive voltage contrast; secondary electron yield; Circuit faults; Electron beams; Electron emission; Failure analysis; Instruments; Semiconductor device manufacture; Surface resistance; Surface topography; Transmission line measurements; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0205-0
  • Electronic_ISBN
    1-4244-0206-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2006.251028
  • Filename
    4017053