Title :
Novel Sample Preparation Methodology on TIM Materials for TEM Microstructure Study
Author :
Chan, C.S. ; Zhao, X.L. ; Chin, J.M.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices, Singapore
Abstract :
This paper presents a successful methodology for TEM sample preparation on indium pre-form thermal interface material (TIM), which is currently used in high-performance microprocessor product. Experimental results show that FIB related artifacts are greatly reduced, thus enables phase morphology study of inter-metallic compound (IMC) layers between TIM and IC chip
Keywords :
focused ion beam technology; integrated circuit packaging; microprocessor chips; specimen preparation; thermal management (packaging); transmission electron microscopy; focused ion beam; integrated circuit chip; intermetallic compounds; microprocessors; phase morphology; sample preparation; thermal interface material; thermal management; transmission electron microscopy; Heat sinks; Indium; Microprocessors; Microstructure; Scanning electron microscopy; Silicon; Substrates; Temperature; Thermal management; Thermal resistance;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
1-4244-0205-0
Electronic_ISBN :
1-4244-0206-9
DOI :
10.1109/IPFA.2006.251029
