DocumentCode
2729869
Title
Novel Sample Preparation Methodology on TIM Materials for TEM Microstructure Study
Author
Chan, C.S. ; Zhao, X.L. ; Chin, J.M.
Author_Institution
Device Anal. Lab., Adv. Micro Devices, Singapore
fYear
2006
fDate
3-7 July 2006
Firstpage
195
Lastpage
199
Abstract
This paper presents a successful methodology for TEM sample preparation on indium pre-form thermal interface material (TIM), which is currently used in high-performance microprocessor product. Experimental results show that FIB related artifacts are greatly reduced, thus enables phase morphology study of inter-metallic compound (IMC) layers between TIM and IC chip
Keywords
focused ion beam technology; integrated circuit packaging; microprocessor chips; specimen preparation; thermal management (packaging); transmission electron microscopy; focused ion beam; integrated circuit chip; intermetallic compounds; microprocessors; phase morphology; sample preparation; thermal interface material; thermal management; transmission electron microscopy; Heat sinks; Indium; Microprocessors; Microstructure; Scanning electron microscopy; Silicon; Substrates; Temperature; Thermal management; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location
Singapore
Print_ISBN
1-4244-0205-0
Electronic_ISBN
1-4244-0206-9
Type
conf
DOI
10.1109/IPFA.2006.251029
Filename
4017054
Link To Document