• DocumentCode
    2729975
  • Title

    A 65 mW 10 b 40 Msample/s BiCMOS Nyquist ADC in 0.8 mm/sup 2/

  • Author

    Hoogzaad, G. ; Roovers, R.

  • Author_Institution
    Philips Res. Lab., Eindhoven, Netherlands
  • fYear
    1999
  • fDate
    17-17 Feb. 1999
  • Firstpage
    320
  • Lastpage
    321
  • Abstract
    This ADC is to be embedded in video-signal-processing ICs. Because this integration is mixed-signal, focus during architectural and circuit design is on low power, low area consumption and low substrate noise sensitivity and generation. The 10 b ADC is based on a cascaded folding and interpolating architecture. Folding and interpolating factors are optimized for low power and low area. The circuit fully exploits the available 5 V supply by means of stacked folding topologies and dimensioning is based on balancing trade-off parameters for the various devices and stages. The untrimmed ADC achieves Nyquist performance at 40 MSample/s: the input frequency, where half an effective bit is lost compared to low input frequency performance, is 20 MHz. The low input frequency performance is 9.2 effective bits. The 0.8 mm/sup 2/ ADC is in 7 GHz, 0.6 /spl mu/m BiCMOS and dissipates 65 mW from a single 5 V supply.
  • Keywords
    BiCMOS integrated circuits; analogue-digital conversion; cascade networks; interpolation; low-power electronics; mixed analogue-digital integrated circuits; video signal processing; 0.6 micron; 10 bit; 20 MHz; 5 V; 65 mW; 7 GHz; BiCMOS; Nyquist ADC; area consumption; cascaded folding/interpolating architecture; input frequency performance; low power; mixed-signal integration; stacked folding topologies; substrate noise sensitivity; video-signal-processing ICs; BiCMOS integrated circuits; Capacitors; Circuit noise; Decoding; Distortion measurement; Frequency; Latches; Power dissipation; Signal to noise ratio; Solid state circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1999. Digest of Technical Papers. ISSCC. 1999 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5126-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.1999.759268
  • Filename
    759268