Title :
Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography
Author :
Hechtl, M. ; Steckert, G. ; Keller, C.
Author_Institution :
Infineon Technol., Munich
Abstract :
Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of results
Keywords :
SQUIDs; infrared imaging; magnetic force microscopy; system-in-package; electrical shorts; lock-in-IR thermography; magnetic microscopy; scanning SQUID microscopy; Failure analysis; Metallization; Micromagnetics; Microscopy; SQUIDs; Semiconductor device packaging; Semiconductor devices; Signal processing; Stimulated emission; Visualization;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
1-4244-0205-0
Electronic_ISBN :
1-4244-0206-9
DOI :
10.1109/IPFA.2006.251041
