DocumentCode
2730095
Title
3D TSV transformer design for DC-DC/AC-DC converter
Author
Zhang, Bo ; Xiong, Yong-Zhong ; Wang, Lei ; Hu, Sanming ; Shi, Jinglin ; Zhuang, Yi-Qi ; Li, Le-Wei ; Yuan, Xiaojun
Author_Institution
Xidian Univ., Xi´´an, China
fYear
2010
fDate
1-4 June 2010
Firstpage
1653
Lastpage
1656
Abstract
This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates that proposed 3D TSV transformer is suitable for AC to DC converter design.
Keywords
AC-DC power converters; Analog circuits; DC-DC power converters; Design optimization; Microelectronics; Power transformers; Radio frequency; Silicon; System-on-a-chip; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV, USA
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490761
Filename
5490761
Link To Document