DocumentCode :
2730095
Title :
3D TSV transformer design for DC-DC/AC-DC converter
Author :
Zhang, Bo ; Xiong, Yong-Zhong ; Wang, Lei ; Hu, Sanming ; Shi, Jinglin ; Zhuang, Yi-Qi ; Li, Le-Wei ; Yuan, Xiaojun
Author_Institution :
Xidian Univ., Xi´´an, China
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
1653
Lastpage :
1656
Abstract :
This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates that proposed 3D TSV transformer is suitable for AC to DC converter design.
Keywords :
AC-DC power converters; Analog circuits; DC-DC power converters; Design optimization; Microelectronics; Power transformers; Radio frequency; Silicon; System-on-a-chip; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490761
Filename :
5490761
Link To Document :
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