• DocumentCode
    2730095
  • Title

    3D TSV transformer design for DC-DC/AC-DC converter

  • Author

    Zhang, Bo ; Xiong, Yong-Zhong ; Wang, Lei ; Hu, Sanming ; Shi, Jinglin ; Zhuang, Yi-Qi ; Li, Le-Wei ; Yuan, Xiaojun

  • Author_Institution
    Xidian Univ., Xi´´an, China
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    1653
  • Lastpage
    1656
  • Abstract
    This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates that proposed 3D TSV transformer is suitable for AC to DC converter design.
  • Keywords
    AC-DC power converters; Analog circuits; DC-DC power converters; Design optimization; Microelectronics; Power transformers; Radio frequency; Silicon; System-on-a-chip; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490761
  • Filename
    5490761