• DocumentCode
    2730198
  • Title

    Interface Characterization for Vertically Aligned Carbon Nanofibers for On-chip Interconnect Applications

  • Author

    Ominami, Y. ; Ngo, Quoc ; Suzuki, Makoto ; Mcilwrath, Kevin ; Jarausch, Konrad ; Cassell, Alan M. ; Li, Jun ; Yang, Cary Y.

  • Author_Institution
    Center for Nanostruct., Santa Clara Univ., CA
  • fYear
    2006
  • fDate
    3-7 July 2006
  • Firstpage
    291
  • Lastpage
    294
  • Abstract
    Nanostructure characterization of carbon nanofibers (CNFs) for on-chip interconnect applications is presented. We propose a novel technique for characterizing interfacial nanostructures of vertically aligned CNFs, optimally suited for cross-sectional imaging with scanning transmission electron microscopy (STEM). Using this technique, vertically aligned CNFs are selectively grown by plasma-enhanced chemical vapor deposition (PECVD), on a substrate comprising a narrow strip (width ~100nm) formed by focused ion beam (FIB). Using high-resolution STEM, we show that CNFs with diameters ranging from 10-100 nm exhibit very similar graphitic layer morphologies at the base contact interface
  • Keywords
    carbon fibres; focused ion beam technology; integrated circuit interconnections; interface structure; nanostructured materials; nanotechnology; plasma CVD; scanning-transmission electron microscopy; 10 to 100 nm; PECVD; STEM; carbon nanofibers; cross-sectional imaging; focused ion beam; interface characterization; nanostructure characterization; on-chip interconnect; plasma-enhanced chemical vapor deposition; scanning transmission electron microscopy; Chemical vapor deposition; Focusing; High-resolution imaging; Ion beams; Morphology; Plasma applications; Plasma chemistry; Scanning electron microscopy; Strips; Transmission electron microscopy; Carbon nanofiber; focused ion beam; on-chip interconnect; scanning transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0205-0
  • Electronic_ISBN
    1-4244-0206-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2006.251048
  • Filename
    4017073