Apply Difference Analysis to Nano-Probing Technique for Reasoning Erratic Defect out in Integrated Circuits

Author

Shen, Garfield ; Chuang, Kevin

Author_Institution

Taiwan Semicond. Manuf. Co. Ltd., Tainan

fYear

2006

fDate

3-7 July 2006

Firstpage

344

Lastpage

347

Abstract

The purpose of this paper is to present a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. This methodology would like to resolve the erratic device with a tailing failure or puzzling feature, but not only to check if the suspect had incorrect characteristic or mismatched transistor parameters

Keywords

failure analysis; fault diagnosis; inference mechanisms; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; deductive methodology; difference analysis; erratic device defect; integrated circuits defects; nanoprobing technique; puzzling feature; tailing failure; Atomic force microscopy; Electric variables measurement; Fault diagnosis; Force measurement; Instruments; Integrated circuit manufacture; Probes; Scanning electron microscopy; Semiconductor device manufacture; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the

Conference_Location

Singapore

Print_ISBN

1-4244-0205-0

Electronic_ISBN

1-4244-0206-9

Type

conf

DOI

10.1109/IPFA.2006.250984

Filename

4017083

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2730380