Title :
Apply Difference Analysis to Nano-Probing Technique for Reasoning Erratic Defect out in Integrated Circuits
Author :
Shen, Garfield ; Chuang, Kevin
Author_Institution :
Taiwan Semicond. Manuf. Co. Ltd., Tainan
Abstract :
The purpose of this paper is to present a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. This methodology would like to resolve the erratic device with a tailing failure or puzzling feature, but not only to check if the suspect had incorrect characteristic or mismatched transistor parameters
Keywords :
failure analysis; fault diagnosis; inference mechanisms; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; deductive methodology; difference analysis; erratic device defect; integrated circuits defects; nanoprobing technique; puzzling feature; tailing failure; Atomic force microscopy; Electric variables measurement; Fault diagnosis; Force measurement; Instruments; Integrated circuit manufacture; Probes; Scanning electron microscopy; Semiconductor device manufacture; Testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
1-4244-0205-0
Electronic_ISBN :
1-4244-0206-9
DOI :
10.1109/IPFA.2006.250984
