DocumentCode
2730474
Title
An application specific LED packaging module integrated with optical, cooling and powering functions
Author
Wang, Kai ; Mao, Zhangming ; Liu, Zongyuan ; Chen, Fei ; Chen, Hao ; Luo, Xiaobing ; Liu, Sheng
Author_Institution
Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China
fYear
2010
fDate
1-4 June 2010
Firstpage
686
Lastpage
692
Abstract
Light-emitting diodes (LEDs) modules integrated with multi-functions are essential to LED luminaires manufacturers. We demonstrated a 16W application specific LED packaging (ASLP) module integrated with optical, cooling and powering functions for road lighting. A lens design method for extended source was introduced briefly and a borosilicate glass freeform lens for the module was designed according to this method. Simulation results demonstrated that lighting performance of the ASLP module could meet requirements of road lighting very well. Moreover, system optical efficiency of the LED road lamp based on the ASLP modules was 19.4% higher than that of traditional LED road lamp. Y shape fins were designed for the heat dissipation of the ASLP module. Thermal performance of the module was checked and verified by thermal calculation and simulation. The junction temperature of LEDs was <90°C when ambient temperature was 35°C. Special designed structure made this ASLP module replaceable and easy to assembly.
Keywords
Cooling; Design methodology; Integrated optics; LED lamps; Lenses; Light emitting diodes; Manufacturing; Packaging; Roads; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV, USA
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490782
Filename
5490782
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