DocumentCode :
2730474
Title :
An application specific LED packaging module integrated with optical, cooling and powering functions
Author :
Wang, Kai ; Mao, Zhangming ; Liu, Zongyuan ; Chen, Fei ; Chen, Hao ; Luo, Xiaobing ; Liu, Sheng
Author_Institution :
Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
686
Lastpage :
692
Abstract :
Light-emitting diodes (LEDs) modules integrated with multi-functions are essential to LED luminaires manufacturers. We demonstrated a 16W application specific LED packaging (ASLP) module integrated with optical, cooling and powering functions for road lighting. A lens design method for extended source was introduced briefly and a borosilicate glass freeform lens for the module was designed according to this method. Simulation results demonstrated that lighting performance of the ASLP module could meet requirements of road lighting very well. Moreover, system optical efficiency of the LED road lamp based on the ASLP modules was 19.4% higher than that of traditional LED road lamp. Y shape fins were designed for the heat dissipation of the ASLP module. Thermal performance of the module was checked and verified by thermal calculation and simulation. The junction temperature of LEDs was <90°C when ambient temperature was 35°C. Special designed structure made this ASLP module replaceable and easy to assembly.
Keywords :
Cooling; Design methodology; Integrated optics; LED lamps; Lenses; Light emitting diodes; Manufacturing; Packaging; Roads; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490782
Filename :
5490782
Link To Document :
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