• DocumentCode
    2730474
  • Title

    An application specific LED packaging module integrated with optical, cooling and powering functions

  • Author

    Wang, Kai ; Mao, Zhangming ; Liu, Zongyuan ; Chen, Fei ; Chen, Hao ; Luo, Xiaobing ; Liu, Sheng

  • Author_Institution
    Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    686
  • Lastpage
    692
  • Abstract
    Light-emitting diodes (LEDs) modules integrated with multi-functions are essential to LED luminaires manufacturers. We demonstrated a 16W application specific LED packaging (ASLP) module integrated with optical, cooling and powering functions for road lighting. A lens design method for extended source was introduced briefly and a borosilicate glass freeform lens for the module was designed according to this method. Simulation results demonstrated that lighting performance of the ASLP module could meet requirements of road lighting very well. Moreover, system optical efficiency of the LED road lamp based on the ASLP modules was 19.4% higher than that of traditional LED road lamp. Y shape fins were designed for the heat dissipation of the ASLP module. Thermal performance of the module was checked and verified by thermal calculation and simulation. The junction temperature of LEDs was <90°C when ambient temperature was 35°C. Special designed structure made this ASLP module replaceable and easy to assembly.
  • Keywords
    Cooling; Design methodology; Integrated optics; LED lamps; Lenses; Light emitting diodes; Manufacturing; Packaging; Roads; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490782
  • Filename
    5490782