Title :
Die thickness effects in RF front-end module stack-die assemblies
Author :
Liu, Kai ; Lee, YongTaek ; Kim, HyunTai ; Kim, Gwang ; Frye, Robert ; Pwint, Hlaing Ma Phoo ; Ahn, Billy
Author_Institution :
STATS ChipPAC, Inc., Tempe, AZ, USA
Abstract :
We have investigated the impact of die thickness on integrated passive device (IPD) performance both in simulation and from measurement for RF stack-die applications. Our simulation approach accurately predicts the behavior of the IPD in such stack-die configuration. This should help us to generate guidelines for RF integrated passive devices to be used in 3D stack-die packages.
Keywords :
Assembly; CMOS technology; Circuits; Dielectric substrates; Inductors; Packaging; Radio frequency; Silicon; Switches; Transceivers;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2010.5490785
