• DocumentCode
    2730794
  • Title

    Adhesive bond analysis using electromagnetic acoustic transducers (EMATs)

  • Author

    Dixon, S. ; Edwards, C. ; Palmer, S.B.

  • Author_Institution
    Dept. of Phys., Warwick Univ., Coventry, UK
  • fYear
    1997
  • fDate
    35499
  • Firstpage
    42522
  • Lastpage
    42523
  • Abstract
    Shows how EMATs have been successfully used to perform non-contact ultrasonic tests on bonded aerospace aluminium plates and how they may also be used to monitor adhesive cure. Several defect types were successfully identified and the adhesive thickness could also be measured which not only allows some compensation for attenuation within the adhesive, but also provides a useful measurement in itself
  • Keywords
    aluminium; Al; adhesive bond analysis; adhesive cure; adhesive thickness; attenuation; bonded aerospace Al plates; defect types; electromagnetic acoustic transducers; noncontact ultrasonic tests;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Inspection of Bonded Structures (Digest No. 1997/008), IEE Colloquium on Techniques for the
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19970053
  • Filename
    598245
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2730794