DocumentCode :
2730795
Title :
In-situ characterization of 3D package systems with on-chip measurements
Author :
Oh, Dan ; Lan, Hai ; Madden, Chris ; Chang, Sam ; Yang, Ling ; Schmitt, Ralf
Author_Institution :
Rambus Inc., Los Altos, CA, USA
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
1485
Lastpage :
1492
Abstract :
Characterization of I/O channels in 3D package systems is quite challenging as it is difficult to observe signal quality. A traditional way of measuring each device in a component level does not capture complex interaction in 3D integration. Although a sense line can be designed to externally measure noise on power lines, it is not feasible for signal lines as it significantly alters the signal quality. Hence, on-chip measurement features are highly desirable for 3D package systems including emerging Through-Silicon Vias (TSV) technology. In this paper, four key on-chip measurement concepts and circuitries are reviewed: eScope for measuring overall link margins, eWave for capturing a signal waveform, nScope for generating and monitoring on-chip power noise, and zScope for measuring power distribution network (PDN). These circuitries are implemented in a low power differential memory interface. The test vehicle is built based on Package-on-Package (PoP) environment. Measurements from the test vehicle are compared with the predicted data based on simulation.
Keywords :
Circuit noise; Circuit testing; Integrated circuit measurements; Network-on-a-chip; Noise measurement; Packaging; Power measurement; System-on-a-chip; Through-silicon vias; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490798
Filename :
5490798
Link To Document :
بازگشت