• DocumentCode
    2730875
  • Title

    A low-cost QFP design for over 8Gbps SerDes applications with inductive return path co-planar waveguide built into the lead frame

  • Author

    Oikawa, Ryuichi

  • Author_Institution
    NEC Electron. Corp., Kawasaki, Japan
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    1479
  • Lastpage
    1484
  • Abstract
    In order to overcome large impedance discontinuities and crosstalk issues observed in the low-cost QFP, a new design scheme called inductive return path co-planar waveguide is proposed, which distributed circuit structure works a passive impedance equalizer at the same time reduces crosstalk necessary to achieve over-10Gbps signal transmission. The proposed design scheme has been applied to an exposed die-pad type TQFP, which has achieved successful 12.8Gbps differential signal transmission. Because this distributed circuit design needs only a small layout space, it is suitable to achieving compact and low-cost consumer device packaging. Additionally this design scheme is applicable not to only the TQFP but also to normal QFP.
  • Keywords
    Bonding; Circuits; Coplanar waveguides; Crosstalk; Electronics packaging; Impedance; Lead; Parasitic capacitance; Signal design; Waveguide discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490801
  • Filename
    5490801