• DocumentCode
    2731004
  • Title

    Laser interconnections on silicon

  • Author

    Nicolas, G.

  • Author_Institution
    CEA-CENG/LETI-MSC, Grenoble
  • fYear
    1988
  • fDate
    13-15 Jun 1988
  • Firstpage
    6
  • Lastpage
    9
  • Abstract
    Laser techniques for reconfiguration (i.e. cutting or linking) of aluminum conductors on silicon wafer-scale integrated circuits are discussed
  • Keywords
    aluminium; cutting; elemental semiconductors; integrated circuit technology; laser beam machining; silicon; Al conductors; Si; cutting; laser interconnections; linking; wafer-scale integrated circuits; Absorption; CMOS technology; Fuses; Integrated circuit interconnections; Laser beam cutting; Laser theory; Random access memory; Semiconductor lasers; Silicon; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
  • Conference_Location
    Neuilly sur Seine
  • Type

    conf

  • DOI
    10.1109/EEMTS.1988.75941
  • Filename
    75941
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2731004