A broadband SSO modeling for a weak signal return-path system based on the large-scale signal-power combined three-dimensional full-wave BEM solver model

An over-2Gbps SSO analysis for a low-cost wire-bonding type BGA package with 32bit DDR interface is demonstrated. The analysis is based on the true transistor-level signal-power integrity simulation, a large-scale, full-wave, full-three dimensional BEM field solver package model and return-path decomposition method which eliminates artificial return-path discontinuities. The simulation results suggests that in the weak return-path system, such as wire-bonding type package, the system performance is mainly dominated by the signal channel design rather than the power supply design in over 2Gbps region, which includes the power supply acting as a secondary signal return-path rather than noise source. The power supply design should be mainly focused on the main driver/pre-driver power supply noise interference in those systems.