DocumentCode
2731077
Title
Computed laminography-a X-ray-method for image analysis of solder joints
Author
Reiter, H. ; Maisl, M. ; Zhou, J. ; Gondrom, S.
Author_Institution
Fraunhofer-Inst. Nondestructive Testing, Saarbrucken, Germany
fYear
1997
fDate
35499
Firstpage
42644
Lastpage
42646
Abstract
The inspection of flat components with complex structures as for example multilayer printed circuit boards requires highly sophisticated nondestructive testing methods. Conventional NDT methods cannot meet the requirements. Computed laminography shows several improvements over classical laminography
Keywords
computerised tomography; X-ray-method; complex structures; computed laminography; flat components; image analysis; multilayer printed circuit boards; nondestructive testing methods; solder joints;
fLanguage
English
Publisher
iet
Conference_Titel
Inspection of Bonded Structures (Digest No. 1997/008), IEE Colloquium on Techniques for the
Conference_Location
London
Type
conf
DOI
10.1049/ic:19970057
Filename
598247
Link To Document