Title :
Computed laminography-a X-ray-method for image analysis of solder joints
Author :
Reiter, H. ; Maisl, M. ; Zhou, J. ; Gondrom, S.
Author_Institution :
Fraunhofer-Inst. Nondestructive Testing, Saarbrucken, Germany
Abstract :
The inspection of flat components with complex structures as for example multilayer printed circuit boards requires highly sophisticated nondestructive testing methods. Conventional NDT methods cannot meet the requirements. Computed laminography shows several improvements over classical laminography
Keywords :
computerised tomography; X-ray-method; complex structures; computed laminography; flat components; image analysis; multilayer printed circuit boards; nondestructive testing methods; solder joints;
Conference_Titel :
Inspection of Bonded Structures (Digest No. 1997/008), IEE Colloquium on Techniques for the
Conference_Location :
London
DOI :
10.1049/ic:19970057
