DocumentCode :
2731423
Title :
Assembly of a polymer lab-on-chip device for impedimetric measurements of D-dimers in whole blood
Author :
Ohlander, A. ; Strohhöfer, C. ; Bock, K. ; Scott, S.M. ; Ali, Z. ; Musil, Peter ; Kyselovic, Jan
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Munich, Germany
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
1004
Lastpage :
1009
Abstract :
This paper reports the development and characterisation of an assembly technology for a polymer lab-on-chip. The system consists of a 150 μm deep hot embossed microfluidic channel in polycarbonate and Au electrodes fabricated separately by photolithography on polyethylenenaphthalate. The system is designed for impedimetric immunoassay detection in whole blood. Electrode layer and microfluidic substrate are joined by means of a 50 μm thick double-sided medical grade adhesive tape, adjusted with an optical alignment system. The bond proved to be liquid tight at room temperature. An alignment accuracy of 34 μm (+/- 19 μm) evaluated over a set of 23 samples, was achieved. The effect of alignment accuracy of the intermediate adhesive film on whole blood flow properties in the device is studied. Already an alignment error of 70 μm increases the flushing out time of whole blood by approximately 20%.
Keywords :
adhesives; bioMEMS; biomedical electrodes; biomedical measurement; biosensors; blood; electric impedance measurement; lab-on-a-chip; microassembling; microchannel flow; microfabrication; microsensors; polymers; D-dimers; assembly technology; depth 150 mum; double-sided medical grade adhesive tape; electrodes; flow properties; hot embossing; impedimetric immunoassay detection; impedimetric measurements; intermediate adhesive film; microfluidic channel; microfluidic substrate; photolithography; polycarbonate; polyethylenenaphthalate; polymer lab-on-chip device; room temperature; size 50 mum; whole blood; Assembly; Biomedical electrodes; Blood; Gold; Immune system; Impedance; Lithography; Microfluidics; Optical films; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490824
Filename :
5490824
Link To Document :
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