DocumentCode
2731423
Title
Assembly of a polymer lab-on-chip device for impedimetric measurements of D-dimers in whole blood
Author
Ohlander, A. ; Strohhöfer, C. ; Bock, K. ; Scott, S.M. ; Ali, Z. ; Musil, Peter ; Kyselovic, Jan
Author_Institution
Fraunhofer Inst. for Reliability & Microintegration, Munich, Germany
fYear
2010
fDate
1-4 June 2010
Firstpage
1004
Lastpage
1009
Abstract
This paper reports the development and characterisation of an assembly technology for a polymer lab-on-chip. The system consists of a 150 μm deep hot embossed microfluidic channel in polycarbonate and Au electrodes fabricated separately by photolithography on polyethylenenaphthalate. The system is designed for impedimetric immunoassay detection in whole blood. Electrode layer and microfluidic substrate are joined by means of a 50 μm thick double-sided medical grade adhesive tape, adjusted with an optical alignment system. The bond proved to be liquid tight at room temperature. An alignment accuracy of 34 μm (+/- 19 μm) evaluated over a set of 23 samples, was achieved. The effect of alignment accuracy of the intermediate adhesive film on whole blood flow properties in the device is studied. Already an alignment error of 70 μm increases the flushing out time of whole blood by approximately 20%.
Keywords
adhesives; bioMEMS; biomedical electrodes; biomedical measurement; biosensors; blood; electric impedance measurement; lab-on-a-chip; microassembling; microchannel flow; microfabrication; microsensors; polymers; D-dimers; assembly technology; depth 150 mum; double-sided medical grade adhesive tape; electrodes; flow properties; hot embossing; impedimetric immunoassay detection; impedimetric measurements; intermediate adhesive film; microfluidic channel; microfluidic substrate; photolithography; polycarbonate; polyethylenenaphthalate; polymer lab-on-chip device; room temperature; size 50 mum; whole blood; Assembly; Biomedical electrodes; Blood; Gold; Immune system; Impedance; Lithography; Microfluidics; Optical films; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490824
Filename
5490824
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