Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

Author

Chao, Huang-Lin ; Chae, Seung-Hyun ; Zhang, Xuefeng ; Lu, Kuan-Hsun ; Im, Jay ; Ho, Paul S.

Author_Institution

Texas Univ., Austin, TX

fYear

2006

fDate

26-30 March 2006

Firstpage

250

Lastpage

255

Abstract

A kinetic analysis was formulated for electromigration induced intermetallics evolution of a Cu-Sn diffusion couple. Simulation of the time dependency of intermetallic growth is consistent with experimental data showing growth and accumulation of a high concentration of vacancies and formation of Kirkendall voids at the Cu₆Sn₅ side of the Cu₃Sn/Cu₆Sn₅ interface

Keywords

chemical interdiffusion; copper alloys; electromigration; flip-chip devices; solders; surface chemistry; tin alloys; vacancies (crystal); voids (solid); Cu₃Sn-Cu₆Sn₅; Kirkendall voids; electromigration reliability; flip-chip packaging; intermetallic growth; kinetic analysis; lead free solder; solder joints; under bump metallization; vacancies; Chemicals; Electromigration; Equations; Finite difference methods; Intermetallic; Kinetic theory; Packaging; Phased arrays; Soldering; Tin; electromigration; flip chip technology; lead free solder; under bump metallization;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-9498-4

Electronic_ISBN

0-7803-9499-2

Type

conf

DOI

10.1109/RELPHY.2006.251224

Filename

4017165