DocumentCode :
2731442
Title :
Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints
Author :
Chao, Huang-Lin ; Chae, Seung-Hyun ; Zhang, Xuefeng ; Lu, Kuan-Hsun ; Im, Jay ; Ho, Paul S.
Author_Institution :
Texas Univ., Austin, TX
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
250
Lastpage :
255
Abstract :
A kinetic analysis was formulated for electromigration induced intermetallics evolution of a Cu-Sn diffusion couple. Simulation of the time dependency of intermetallic growth is consistent with experimental data showing growth and accumulation of a high concentration of vacancies and formation of Kirkendall voids at the Cu6Sn5 side of the Cu3Sn/Cu6Sn5 interface
Keywords :
chemical interdiffusion; copper alloys; electromigration; flip-chip devices; solders; surface chemistry; tin alloys; vacancies (crystal); voids (solid); Cu3Sn-Cu6Sn5; Kirkendall voids; electromigration reliability; flip-chip packaging; intermetallic growth; kinetic analysis; lead free solder; solder joints; under bump metallization; vacancies; Chemicals; Electromigration; Equations; Finite difference methods; Intermetallic; Kinetic theory; Packaging; Phased arrays; Soldering; Tin; electromigration; flip chip technology; lead free solder; under bump metallization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251224
Filename :
4017165
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2731442
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