DocumentCode :
2731496
Title :
Sram Operational Voltage Shifts in the Presence of Gate Oxide Defects in 90 NM SOI
Author :
Ramadurai, Vinod ; Rohrer, Norman ; Gonzalez, Christopher
Author_Institution :
IBM Syst. & Technol. Group, Essex Junction, VT
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
270
Lastpage :
273
Abstract :
The continued scaling of gate oxide thickness in CMOS transistors has made dielectric integrity paramount to system functionality at low voltages. In this paper, the effect of gate oxide breakdown on the minimum operating voltage (Vddmin) of a six transistor SRAM cell has been examined. A new cell reliability model was developed to explain non-monotonic operational voltage shifts through product reliability stress. Through simulation it was determined that non-monotonic voltage shifts can occur if random gate defects counter existing SRAM cell asymmetries. Furthermore, it has been shown that monotonic voltage shifts can be created with significantly different magnitudes of gate oxide defects
Keywords :
CMOS memory circuits; SRAM chips; integrated circuit reliability; silicon-on-insulator; 90 nm; CMOS transistors; SRAM cell; gate oxide breakdown; gate oxide defects; operational voltage shifts; product reliability stress; silicon-on-insulator; Breakdown voltage; CMOS technology; Electric breakdown; Low voltage; Niobium compounds; Predictive models; Random access memory; Redundancy; Stress; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251227
Filename :
4017168
Link To Document :
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