DocumentCode
2731496
Title
Sram Operational Voltage Shifts in the Presence of Gate Oxide Defects in 90 NM SOI
Author
Ramadurai, Vinod ; Rohrer, Norman ; Gonzalez, Christopher
Author_Institution
IBM Syst. & Technol. Group, Essex Junction, VT
fYear
2006
fDate
26-30 March 2006
Firstpage
270
Lastpage
273
Abstract
The continued scaling of gate oxide thickness in CMOS transistors has made dielectric integrity paramount to system functionality at low voltages. In this paper, the effect of gate oxide breakdown on the minimum operating voltage (Vddmin) of a six transistor SRAM cell has been examined. A new cell reliability model was developed to explain non-monotonic operational voltage shifts through product reliability stress. Through simulation it was determined that non-monotonic voltage shifts can occur if random gate defects counter existing SRAM cell asymmetries. Furthermore, it has been shown that monotonic voltage shifts can be created with significantly different magnitudes of gate oxide defects
Keywords
CMOS memory circuits; SRAM chips; integrated circuit reliability; silicon-on-insulator; 90 nm; CMOS transistors; SRAM cell; gate oxide breakdown; gate oxide defects; operational voltage shifts; product reliability stress; silicon-on-insulator; Breakdown voltage; CMOS technology; Electric breakdown; Low voltage; Niobium compounds; Predictive models; Random access memory; Redundancy; Stress; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251227
Filename
4017168
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