DocumentCode :
2731613
Title :
Approach to Extrapolating Reliability of Circuits Operating in a Varying and Low Temperature Range
Author :
Chen, Yuan ; Westergard, Lynett ; Mojaradi, Mohammad ; Billman, Curtis ; Cozy, Scott ; Kolawa, Elizabeth
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
307
Lastpage :
312
Abstract :
We present an approach to extrapolating circuit reliability to use conditions with a varying and low temperature range. The approach integrates the impact of the statistical nature of transistor lifetime on circuit reliability to give a more realistic circuit reliability projection. Even though the approach is demonstrated for low temperature applications by focusing on hot carrier aging failure mechanism, it can be applied and easily extended to other failure mechanisms for any varying temperature operating conditions
Keywords :
ageing; circuit reliability; cryogenic electronics; extrapolation; hot carriers; circuit reliability; hot carrier aging failure; product reliability; transistor lifetime; Aging; Extrapolation; Failure analysis; Hot carriers; Integrated circuit reliability; Propulsion; Semiconductor device reliability; Substrates; Temperature distribution; Voltage; circuit reliability; low temperature electronics; product reliability; use condition extrapolation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251233
Filename :
4017174
Link To Document :
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