Approach to Extrapolating Reliability of Circuits Operating in a Varying and Low Temperature Range

Author

Chen, Yuan ; Westergard, Lynett ; Mojaradi, Mohammad ; Billman, Curtis ; Cozy, Scott ; Kolawa, Elizabeth

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA

fYear

2006

fDate

26-30 March 2006

Firstpage

307

Lastpage

312

Abstract

We present an approach to extrapolating circuit reliability to use conditions with a varying and low temperature range. The approach integrates the impact of the statistical nature of transistor lifetime on circuit reliability to give a more realistic circuit reliability projection. Even though the approach is demonstrated for low temperature applications by focusing on hot carrier aging failure mechanism, it can be applied and easily extended to other failure mechanisms for any varying temperature operating conditions

Keywords

ageing; circuit reliability; cryogenic electronics; extrapolation; hot carriers; circuit reliability; hot carrier aging failure; product reliability; transistor lifetime; Aging; Extrapolation; Failure analysis; Hot carriers; Integrated circuit reliability; Propulsion; Semiconductor device reliability; Substrates; Temperature distribution; Voltage; circuit reliability; low temperature electronics; product reliability; use condition extrapolation;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-9498-4

Electronic_ISBN

0-7803-9499-2

Type

conf

DOI

10.1109/RELPHY.2006.251233

Filename

4017174