DocumentCode :
2731647
Title :
Impact of Nitrogen Incorporation in SiOx/HfSiO Gate Stacks on Negative Bias Temperature Instabilities
Author :
Aoulaiche, M. ; Houssa, M. ; Conard, T. ; Groeseneken, G. ; De Gendt, Stefan ; Heyns, M.M.
Author_Institution :
IMEC, Leuven
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
317
Lastpage :
324
Abstract :
The impact of nitridation anneal of Hf-silicates based metal-gated pMOSFETs on negative bias temperature instability (NBTI) is investigated. Non-nitrided stacks annealed in N2 or O2 and nitrided stacks either annealed in NH3 or exposed to decoupled plasma nitridation (DPN) are measured. For non-nitrided stacks, NBT degradation is mainly due to fast-states generation. A much enhanced NBT degradation is observed, in nitrided stacks due to the additional generation of slow states. 10 years lifetime are not reached in the nitrided stacks. A physical model, based on the field enhanced hole trapping in the dielectric during NBTI stress, is proposed to simulate slow-states generation
Keywords :
MOSFET; annealing; hafnium compounds; hole traps; nitridation; nitrogen; semiconductor device models; semiconductor device reliability; HfSiO; NH3; decoupled plasma nitridation; gate stacks; hole trapping; negative bias temperature instabilities; nitridation anneal; pMOSFET; Annealing; Degradation; Dielectrics; MOSFETs; Negative bias temperature instability; Niobium compounds; Nitrogen; Plasma measurements; Plasma temperature; Titanium compounds; HfSiO(N); NBTI; fast states; nitrogen; pMOSFETs; slow states;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251236
Filename :
4017176
Link To Document :
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