• DocumentCode
    2731647
  • Title

    Impact of Nitrogen Incorporation in SiOx/HfSiO Gate Stacks on Negative Bias Temperature Instabilities

  • Author

    Aoulaiche, M. ; Houssa, M. ; Conard, T. ; Groeseneken, G. ; De Gendt, Stefan ; Heyns, M.M.

  • Author_Institution
    IMEC, Leuven
  • fYear
    2006
  • fDate
    26-30 March 2006
  • Firstpage
    317
  • Lastpage
    324
  • Abstract
    The impact of nitridation anneal of Hf-silicates based metal-gated pMOSFETs on negative bias temperature instability (NBTI) is investigated. Non-nitrided stacks annealed in N2 or O2 and nitrided stacks either annealed in NH3 or exposed to decoupled plasma nitridation (DPN) are measured. For non-nitrided stacks, NBT degradation is mainly due to fast-states generation. A much enhanced NBT degradation is observed, in nitrided stacks due to the additional generation of slow states. 10 years lifetime are not reached in the nitrided stacks. A physical model, based on the field enhanced hole trapping in the dielectric during NBTI stress, is proposed to simulate slow-states generation
  • Keywords
    MOSFET; annealing; hafnium compounds; hole traps; nitridation; nitrogen; semiconductor device models; semiconductor device reliability; HfSiO; NH3; decoupled plasma nitridation; gate stacks; hole trapping; negative bias temperature instabilities; nitridation anneal; pMOSFET; Annealing; Degradation; Dielectrics; MOSFETs; Negative bias temperature instability; Niobium compounds; Nitrogen; Plasma measurements; Plasma temperature; Titanium compounds; HfSiO(N); NBTI; fast states; nitrogen; pMOSFETs; slow states;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9498-4
  • Electronic_ISBN
    0-7803-9499-2
  • Type

    conf

  • DOI
    10.1109/RELPHY.2006.251236
  • Filename
    4017176