DocumentCode
2731750
Title
Analysis of the Back-Gate Effect on the On-State Breakdown Voltage of Smartpower SOI Devices
Author
Schwantes, Stefan ; Fürthaler, Josef ; Schauwecker, Bernd ; Dietz, Franz ; Graf, Michael ; Dudek, Volker
Author_Institution
Technol. Dev., Atmel Germany GmbH, Heilbronn
fYear
2006
fDate
26-30 March 2006
Firstpage
345
Lastpage
351
Abstract
This paper discusses the impact of the back gate bias on the on-state drain breakdown voltage of high-voltage SOI MOSFETs. This is mandatory in order to understand the physical mechanisms behind the limitations of the safe operation area of SOI power devices. The back gate electrode of the SOI material will add an additional dimension to the safe operation area, thereby causing further reliability constraints on the circuit design. For the first time an analytical model of the breakdown voltage covering the reasonable back gate voltage range is presented providing a first step towards a closed form circuit simulation of this effect. It is shown that the back gate potential impacts on the breakdown behaviour by modulating the carrier distribution in the drift region, the base transport factor of the parasitic bipolar transistor and the drift region resistance
Keywords
power MOSFET; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; silicon-on-insulator; MOSFET; back gate electrode; back-gate effect; breakdown voltage; drift region resistance; parasitic bipolar transistor; safe operation area; silicon-on-insulator; smart power devices; Analytical models; Bipolar transistors; Breakdown voltage; Circuit simulation; Circuit synthesis; Electric breakdown; Electrodes; MOSFETs; Materials reliability; Semiconductor optical amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251241
Filename
4017181
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