DocumentCode
2731830
Title
Evaluation of copper thick film for high frequency digital interconnection
Author
Beyne, Eric ; Roggen, J. ; Mertens, Robert
Author_Institution
Interuniv. Micro-Electron. Centre, IMEC, Leuven
fYear
1988
fDate
13-15 Jun 1988
Firstpage
26
Lastpage
29
Abstract
Copper thick-film multilayer technology is evaluated for use as a high-frequency digital interconnect in systems with bit rates up to 600 Mb/s. To help design the interconnect, software tools which calculate the electrical parameters and performance for any two-dimensional geometry were developed and are described. The analysis is based on a quasistatic method. A thick-film multilayer test structure with high bandwidth and 50-Ω impedance was realized. The calculated line parameters show good agreement with the measured values
Keywords
circuit layout CAD; copper; integrated circuit technology; thick film circuits; 600 Mbit/s; CAD; Cu; IC technology; high frequency digital interconnection; quasistatic method; software tools; thick-film multilayer technology; two-dimensional geometry; Bandwidth; Bit rate; Copper; Frequency; Geometry; Nonhomogeneous media; Software design; Software tools; Testing; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location
Neuilly sur Seine
Type
conf
DOI
10.1109/EEMTS.1988.75946
Filename
75946
Link To Document