• DocumentCode
    2731878
  • Title

    Impact of Thin WSIX Insertion in Tungsten Polymetal Gate on Gate Oxide Reliability and Gate Contact Resistance

  • Author

    Sung, Min Gyu ; Lim, Kwan-Yong ; Cho, Heung-Jae ; Lee, Seung Ryong ; Jang, Se-Aug ; Yang, Hong-Seon ; Kim, Kwangok ; Kwak, Noh-Jung ; Sohn, Hyun-Chul ; Kim, Jin Woong

  • Author_Institution
    R&D Div., Hynix Semicond. Inc., Kyoungki
  • fYear
    2006
  • fDate
    26-30 March 2006
  • Firstpage
    374
  • Lastpage
    378
  • Abstract
    By inserting thin WSix layer in tungsten poly gate stack we can effectively relieve the mechanical stress of gate hard mask nitride film, which contributes to the better gate oxide reliability and stress-immunity of transistor. This insertion also could prevent the formation of Si-N dielectric layer atop poly-Si, which could lower the contact resistance between poly and tungsten effectively
  • Keywords
    contact resistance; diffusion barriers; semiconductor device reliability; silicon compounds; tungsten; tungsten compounds; WSix-WN; gate contact resistance; gate oxide reliability; mechanical stress; poly gate stack; stress immunity; thin WSix insertion; tungsten polymetal gate; Chemical vapor deposition; Contact resistance; Electrodes; MOS capacitors; MOSFET circuits; Pattern analysis; Random access memory; Stress; Tin; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9498-4
  • Electronic_ISBN
    0-7803-9499-2
  • Type

    conf

  • DOI
    10.1109/RELPHY.2006.251247
  • Filename
    4017187