DocumentCode
2731878
Title
Impact of Thin WSIX Insertion in Tungsten Polymetal Gate on Gate Oxide Reliability and Gate Contact Resistance
Author
Sung, Min Gyu ; Lim, Kwan-Yong ; Cho, Heung-Jae ; Lee, Seung Ryong ; Jang, Se-Aug ; Yang, Hong-Seon ; Kim, Kwangok ; Kwak, Noh-Jung ; Sohn, Hyun-Chul ; Kim, Jin Woong
Author_Institution
R&D Div., Hynix Semicond. Inc., Kyoungki
fYear
2006
fDate
26-30 March 2006
Firstpage
374
Lastpage
378
Abstract
By inserting thin WSix layer in tungsten poly gate stack we can effectively relieve the mechanical stress of gate hard mask nitride film, which contributes to the better gate oxide reliability and stress-immunity of transistor. This insertion also could prevent the formation of Si-N dielectric layer atop poly-Si, which could lower the contact resistance between poly and tungsten effectively
Keywords
contact resistance; diffusion barriers; semiconductor device reliability; silicon compounds; tungsten; tungsten compounds; WSix-WN; gate contact resistance; gate oxide reliability; mechanical stress; poly gate stack; stress immunity; thin WSix insertion; tungsten polymetal gate; Chemical vapor deposition; Contact resistance; Electrodes; MOS capacitors; MOSFET circuits; Pattern analysis; Random access memory; Stress; Tin; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251247
Filename
4017187
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