Reliability in MEMS Packaging

Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and microsystems. While packaging contributes to the effective production cost of MEMS devices, reliability addresses consumer´s confidence in and expectation on sustainable performance of the products. There are a number of factors that contribute to the reliability of MEMS; packaging, in particular, in bonding and sealing, material characterization relating to operating and environmental conditions, credible design considerations, the techniques for mitigating intrinsic stresses/strains induced by fabrications and testing for reliability are a few of these factors. This paper will offer an overview of these factors with proposed resolutions to issues relating to the reliability of these products