Thermal measurements of two layered thin films of different orders on copper

Thermal interface resistance of solids is an important factor for heat conduction from one solid to another. Interface resistance disrupts heat flow in systems like CPUs and various solid state devices like LEDs. Interface materials play an important role in heat transport through an interface. In this study, TiN/Ti with different Ti thickness and Ti/TiN was coated on a copper substrate. In general all samples show increase in overall thermal conductivity as pressure was increased. The overall thermal conductivity of the material is measured at different contact pressures. It was observed that by switching the order of the coating, overall thermal conductivity changed drastically. It was also observed that thermal conductivity of the sample reduced when coating thickness was reduced.