Title :
Mounting open-via-chip-carriers (for 100 to 300 inputs/outputs i.c.)
Author_Institution :
Thomson-CSF/CIMSA-SINTRA, Colombes
Abstract :
Techniques for the efficient soldering of open-via chip-carriers (OVCC) to substrates are discussed. The development is described of OVCCs for the encapsulation of integrated circuits with 300 inputs/outputs
Keywords :
encapsulation; integrated circuit technology; soldering; encapsulation; integrated circuits; open-via-chip-carriers; soldering; Electrostatic discharge; Inspection; Instruments; Lead; Optimized production technology; Packaging; Printing; Protection; Soldering; Very high speed integrated circuits;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75948
