DocumentCode :
2732192
Title :
A high-throughput silicon epitaxy system for photovoltaic application
Author :
Fu, Jianming ; Rozenzon, Yan ; Ding, Peijun ; Anderson, Roger ; Trujillo, Robert ; Beese, Steve ; Chen, David Z. ; Chung, Beom-suk ; Hu, Heather ; Ginzburg, Leon ; Mandelboym, Mark ; Tang, Jinsong ; Yu, Chentao ; Heng, Benjamin ; Song, Guanghua ; Xu, Zhen
Author_Institution :
Sierra Solar Power, Inc., Fremont, CA, USA
fYear :
2010
fDate :
20-25 June 2010
Abstract :
We have developed a high-throughput Si CVD epitaxy system for photovoltaic application. The system was designed with high throughput, low energy cost, and high utilization of precursors, thus enabling extremely low cost Si epitaxial film for photovoltaic application. The system will be capable of processing a large batch of >320 wafers in less than an hour. The novel system architecture effectively utilizes resources such as electricity and process gases, and the processing cost can be as low as $0.22 per wafer for 50 μm deposition. Initial results confirmed good power utilization and excellent film properties. As an example of application, solar cells have been fabricated with epitaxial films on wafers from ingots pulled from metallurgical Si in Czochralski method.
Keywords :
chemical vapour deposition; crystal growth from melt; epitaxial growth; semiconductor epitaxial layers; silicon; solar cells; CVD epitaxy system; Czochralski method; Si; epitaxial films; high-throughput silicon epitaxy system; ingots; metallurgical Si; photovoltaic application; solar cells; wafers; Boron; Epitaxial growth; Europe; Heating; Production;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location :
Honolulu, HI
ISSN :
0160-8371
Print_ISBN :
978-1-4244-5890-5
Type :
conf
DOI :
10.1109/PVSC.2010.5614080
Filename :
5614080
Link To Document :
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