DocumentCode :
2732357
Title :
Outsource bond pad reliability methodology setup for foundry process changes
Author :
Ng Hong Seng
Author_Institution :
Quality, Reliability, X-FAB Sarawak, Kuching, Malaysia
fYear :
2011
fDate :
25-28 Sept. 2011
Firstpage :
696
Lastpage :
699
Abstract :
Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS outsourcing as many of the factors affecting shear strength lying on the wire bonding parameters and shear test setup. This paper presents the outsourcing experiences of WBS tests and good shear strength was achieved from the outsource laboratory.
Keywords :
foundries; lead bonding; reliability; shear strength; ball bond; foundry process changes; metal bond pad; outsource bond pad reliability; shear strength; wafer-level WBS; wire bond shear test; wire bonding parameters; wire pull test; Bonding; Force; Foundries; Histograms; Outsourcing; Reliability; Wires; Reliability; Wire Bond Shear;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications (ISIEA), 2011 IEEE Symposium on
Conference_Location :
Langkawi
Print_ISBN :
978-1-4577-1418-4
Type :
conf
DOI :
10.1109/ISIEA.2011.6108805
Filename :
6108805
Link To Document :
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