Finite element analysis of dispersion characteristics of microstrip lines lying near substrate and ground plane edges

Author

Crain, Bruce R. ; Peterson, Andrew F.

Author_Institution

Lockheed Martin Aeronaut. Syst., Marietta, GA, USA

fYear

1996

fDate

19-23 Aug 1996

Firstpage

448

Lastpage

452

Abstract

The dispersion characteristics of microstrip lines lying near substrate and ground plane edges are examined using the finite element method (FEM). Microstrips lying near two types of edges are analyzed: a substrate edge on an infinite ground plane and a substrate/ground plane edge. The FEM formulation is based on the curl-curl vector Helmholtz equation. Mixed-order covariant projection finite elements are employed to avoid problems with spurious modes. Local absorbing boundary conditions are used to truncate the FEM mesh in the open region. An efficient sparse eigensolver, based on iterative methods, is used to solve the resulting non-linear eigenvalue equation

Keywords

Helmholtz equations; MMIC; dispersion (wave); eigenvalues and eigenfunctions; finite element analysis; iterative methods; microstrip lines; printed circuits; transmission line theory; FEM; curl-curl vector Helmholtz equation; dispersion characteristics; finite element analysis; ground plane edges; iterative methods; local absorbing boundary conditions; microstrip lines; mixed-order covariant projection finite elements; nonlinear eigenvalue equation; sparse eigensolver; substrate edges; Boundary conditions; Dielectric materials; Dielectric substrates; Eigenvalues and eigenfunctions; Electromagnetic waveguides; Finite element methods; Geometry; MMICs; Microstrip; Nonlinear equations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1996. Symposium Record. IEEE 1996 International Symposium on

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-3207-5

Type

conf

DOI

10.1109/ISEMC.1996.561410

Filename

561410