Title :
Understanding Mechanism of Film Attach Material Void Formation in Electronic Packages
Author_Institution :
Intel Technol. Philippines Inc.
Abstract :
This paper presents an understanding of void formation in film attach materials which results from the interaction with the different process parameters during package assembly through various laboratory and assembly experiments. This study also comprehends the mechanism of delaminating during reliability stress and data gathered from these experiments were useful in the assessment of new materials for new generation packages
Keywords :
assembling; delamination; electronics packaging; assembly experiments; delamination; electronic packages; film attach material; laboratory experiments; package assembly; process parameters; reliability stress; void formation; Assembly; Conducting materials; Delamination; Electronics packaging; Laboratories; Materials reliability; Microassembly; Semiconductor films; Substrates; Temperature; delamination; film attach material; void formation;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
DOI :
10.1109/RELPHY.2006.251287
