Title :
Simulation and analysis of in-line thermal and microwave curing of TAB encapsulants
Author_Institution :
Motorola, Ft. Lauderdale, FL
Abstract :
A commercially available epoxy encapsulant was crosslinked using several curing profiles. The thermal and dielectric properties were characterized during and after the curing process. The results were used to develop an efficient curing profile using inline infrared- and microwave-assisted curing ovens
Keywords :
encapsulation; integrated circuit technology; packaging; polymers; radiofrequency heating; IC technology; IR curing; RF heating; TAB encapsulants; curing profiles; dielectric properties; epoxy encapsulant; in-line thermal curing; microwave curing; polymers; Analytical models; Curing; Dielectric losses; Dielectric measurements; Electrochemical impedance spectroscopy; Glass; Packaging; Temperature; Thermal expansion; Viscosity;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75951
