DocumentCode
2732680
Title
Simulation and analysis of in-line thermal and microwave curing of TAB encapsulants
Author
Pennisi, R.
Author_Institution
Motorola, Ft. Lauderdale, FL
fYear
1988
fDate
13-15 Jun 1988
Firstpage
45
Lastpage
48
Abstract
A commercially available epoxy encapsulant was crosslinked using several curing profiles. The thermal and dielectric properties were characterized during and after the curing process. The results were used to develop an efficient curing profile using inline infrared- and microwave-assisted curing ovens
Keywords
encapsulation; integrated circuit technology; packaging; polymers; radiofrequency heating; IC technology; IR curing; RF heating; TAB encapsulants; curing profiles; dielectric properties; epoxy encapsulant; in-line thermal curing; microwave curing; polymers; Analytical models; Curing; Dielectric losses; Dielectric measurements; Electrochemical impedance spectroscopy; Glass; Packaging; Temperature; Thermal expansion; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location
Neuilly sur Seine
Type
conf
DOI
10.1109/EEMTS.1988.75951
Filename
75951
Link To Document