Title :
Hirel Double Sided Package for Si/SiC Power Module
Author :
Borowy, B. ; Casey, L. ; Davis, G. ; Cornell, J.
Author_Institution :
SatCon Appl. Technol., Boston, MA
Abstract :
In this paper we present the design, and preliminary results, of a new hi-rel package for a hybrid Si/SiC power device package with minimal mechanical and electrical parasitic and contrast this new packaging technology with conventional COTS power device packaging using insulated metal substrates (IMS), conventional wire bonds and lug terminations
Keywords :
lead bonding; power semiconductor devices; semiconductor device packaging; silicon compounds; wide band gap semiconductors; COTS; HiRel double sided package; IMS; Si-SiC; hi-rel package; hybrid semiconductor power device package; insulated metal substrates; lug terminations; semiconductor power module; wire bonds; Copper; Costs; Electronic packaging thermal management; Inductance; Multichip modules; Semiconductor device packaging; Silicon carbide; Substrates; Temperature; Wire;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
DOI :
10.1109/RELPHY.2006.251288
