DocumentCode :
2732871
Title :
Advanced large-signal modeling of GaN-HEMTs
Author :
Berroth, M. ; Chigaeva, E. ; Dettmann, I. ; Wieser, N. ; Vogel, W. ; Roll, H. ; Scholz, F. ; Schweizer, H.
Author_Institution :
Inst. of Electr. & Opt. Commun. Eng., Univ. of Stuttgart, Germany
fYear :
2002
fDate :
6-8 Aug. 2002
Firstpage :
172
Lastpage :
180
Abstract :
For improved non-linear modeling of AlGaN/GaN high electron mobility transistors, a large-signal model originally developed for GaAs-based devices has been extended by introduction of a thermal sub-circuit to account for self-heating. Thereby, DC output characteristics which typically show negative output conductance at a high dissipating power level are well reproduced. Since self-heating also effects the transconductance, which is related to S21 at RF conditions, the comparison of broadband S-parameter simulations and measurements revealed significant improvement when using the extended model. First experimental and theoretical investigations on the transient behavior at pulsed conditions are finally presented.
Keywords :
III-V semiconductors; S-parameters; aluminium compounds; gallium compounds; power HEMT; semiconductor device measurement; semiconductor device models; thermal analysis; transient response; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT large-signal nonlinear modeling; DC output characteristics; GaAs-based devices; broadband RF S-parameters; high dissipating power levels; high electron mobility transistors; negative output conductance; pulsed condition transient behavior; self-heating thermal sub-circuits; transconductance; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Pulse amplifiers; Scattering parameters; Silicon carbide; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
Print_ISBN :
0-7803-7478-9
Type :
conf
DOI :
10.1109/LECHPD.2002.1146747
Filename :
1146747
Link To Document :
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