• DocumentCode
    2732871
  • Title

    Advanced large-signal modeling of GaN-HEMTs

  • Author

    Berroth, M. ; Chigaeva, E. ; Dettmann, I. ; Wieser, N. ; Vogel, W. ; Roll, H. ; Scholz, F. ; Schweizer, H.

  • Author_Institution
    Inst. of Electr. & Opt. Commun. Eng., Univ. of Stuttgart, Germany
  • fYear
    2002
  • fDate
    6-8 Aug. 2002
  • Firstpage
    172
  • Lastpage
    180
  • Abstract
    For improved non-linear modeling of AlGaN/GaN high electron mobility transistors, a large-signal model originally developed for GaAs-based devices has been extended by introduction of a thermal sub-circuit to account for self-heating. Thereby, DC output characteristics which typically show negative output conductance at a high dissipating power level are well reproduced. Since self-heating also effects the transconductance, which is related to S21 at RF conditions, the comparison of broadband S-parameter simulations and measurements revealed significant improvement when using the extended model. First experimental and theoretical investigations on the transient behavior at pulsed conditions are finally presented.
  • Keywords
    III-V semiconductors; S-parameters; aluminium compounds; gallium compounds; power HEMT; semiconductor device measurement; semiconductor device models; thermal analysis; transient response; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT large-signal nonlinear modeling; DC output characteristics; GaAs-based devices; broadband RF S-parameters; high dissipating power levels; high electron mobility transistors; negative output conductance; pulsed condition transient behavior; self-heating thermal sub-circuits; transconductance; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Pulse amplifiers; Scattering parameters; Silicon carbide; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
  • Print_ISBN
    0-7803-7478-9
  • Type

    conf

  • DOI
    10.1109/LECHPD.2002.1146747
  • Filename
    1146747