Infrared Ray Emission (IREM) Based Post-Silicon Power Debug Flows Developed for Chip Power Performance

Author

Chen, Yuan-Chuan Steven ; Lu, Daniel ; Bockelman, Dan ; Ma, Matthew ; Wan, Ifar

Author_Institution

Intel Corp.

fYear

2006

fDate

26-30 March 2006

Firstpage

639

Lastpage

640

Abstract

Pre-silicon power modeling, post-silicon power validation, and power debugs design efforts have significantly increased to meet speed performance, reliability deliverables and design robustness for manufacturing. IREM based power debug flow has been developed to isolate marginal circuits with excessive static and dynamic power consumption. Three root cause analysis cases are presented to demonstrate the success of this novel post-silicon debug flow

Keywords

design for manufacture; integrated circuit manufacture; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; microprocessor chips; IREM; chip power performance; infrared ray emission; marginal circuits isolation; post-silicon power debug flows; post-silicon power validation; power debugs design; root cause analysis; CMOS technology; Circuit simulation; Circuit testing; Computer bugs; Design methodology; Design optimization; Failure analysis; Microprocessors; Robustness; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-9498-4

Electronic_ISBN

0-7803-9499-2

Type

conf

DOI

10.1109/RELPHY.2006.251301

Filename

4017242