• DocumentCode
    2733169
  • Title

    Intermodulation distortion as indicator for interconnect degradation

  • Author

    Krüger, Michael ; Nils, F Nissen ; Reichl, Herbert

  • Author_Institution
    Tech. Univ. Berlin, Berlin, Germany
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    477
  • Lastpage
    483
  • Abstract
    The scope of this paper lies in the justification and combination of observed non-linearities in passive components with their remaining lifetime. We investigate the applicability of non-linearity measurement techniques for detecting interconnect degradations in their early state. In the first part of the paper we describe the generation of intermodulation signals and show ways to use these signals as indicator for upcoming failures. This technique could overcome the drawbacks in sensitivity of more traditional measurement techniques like resistance measurements. In the second part, two kinds of specimen are used to investigate their non-linear behavior during degradation. Failure analysis is done to inspect the degradation states of the specimens and compare it to measurement. At the end we show experimentally a link between non-linearity and degradation and give an outlook to future improvements.
  • Keywords
    Assembly; Condition monitoring; Degradation; Electrical resistance measurement; Frequency; Integrated circuit interconnections; Intermodulation distortion; Measurement techniques; Signal generators; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490927
  • Filename
    5490927